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Defect detection on optoelectronical devices to assist decision making: A real industry 4.0 case study | Joint Pubblication by SENSAP Swiss, Core Innovation, Brunel University, ATLANTIS Engeneering, Alpes Lasers and Fraunhofer IOF

Defect detection on optoelectronical devices to assist decision making: A real industry 4.0 case study | Joint Pubblication by SENSAP Swiss, Core Innovation, Brunel University, ATLANTIS Engeneering, Alpes Lasers and Fraunhofer IOF

  • Posted by iqonic
  • On September 5, 2022
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At the end of August 2022, iQonic partners SENSAP Swiss AG, CORE Innovation, Brunel University London, ATLANTIS Engineering S.A., Fraunhofer IOF  and Alpes Lasers published a paper titled “Defect detection on optoelectronical devices to assist decision making: A real industry 4.0 case study”.

This open-access paper presents an innovative approach, based on industry 4.0 concepts, for monitoring the life cycle of optoelectronical devices, by adopting image processing and deep learning techniques regarding defect detection. The proposed system comprises defect detection and categorization during the front-end part of the optoelectronic device production process, providing a two-stage approach; the first is the actual defect identification on individual components at the wafer level, while the second is the pre-classification of these components based on the recognized defects.

The proposed solution has been implemented in a real industrial use case in laser manufacturing. Analysis shows that chips validated through the proposed process have a probability to lase at a specific frequency six times higher than the fully rejected ones.

Figure 5 (Original wafer image vs. corresponding defect detection result)

The publication is a Scientific article in Frontiers the 3rd most-cited and 6th largest research publisher and open science platform. This article is part of the Research Topic Zero Defect Manufacturing in the Era of Industry 4.0 for Achieving  Sustainable and Resilient Manufacturing. This paper presents the project iQonic alignment with the need and aim of the end user to address the quality control of the produced wafer while the detection of defect through the production increased the performance itself.

Link to the original article:

https://www.frontiersin.org/articles/10.3389/fmtec.2022.946452/full?&utm_source=Email_to_authors_&utm_medium=Email&utm_content=T1_11.5e1_author&utm_campaign=Email_publication&field=&journalName=Frontiers_in_Manufacturing_Technology&id=946452

 

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